R5027822 - Senior Electronic Design Engineer

Akkodis is recruiting for a Electronics Design Enginee r for an aerospace manufacturer in the Grand Rapids, MI, Clearwater, FL or Melbourne, FL areas. This is an onsite direct hire position with a pay rate of $125K annually to $160K annually, depending on education, experience and location.
This position, which offers a blend of onsite and hybrid work arrangements, is based in Grand Rapids, Clearwater, FL or Melbourne, FL and necessitates a presence in the office for 2-3 days each week. An extensive corporate relocation package is also available for eligible candidates.
Job Description
The Senior Electronics Design Engineer is responsible for understanding current technology trends and state of the art processor, System On Chip, and FPGA components. The role influences avionics hardware architectures and supports new bid/proposals.
In this role you will be conducting and mentoring experienced design engineers in board level circuit design, integration, verification and documentation of leading-edge aerospace processor and/or FPGA assemblies.
Roles and Responsibilities:

• Responsible for architecting moderately complex avionic computer hardware systems that include both digital and analog components.

• Maintain specialized knowledge in semiconductor processors, System-on-Chip, and FPGA component architectures.

• Have In-depth knowledge of hardware design best practices and integration with electronics manufacturing; have working knowledge of competition and the factors that differentiate them in the market.

Required Qualifications:

• Bachelor's degree from an accredited university/college in Electrical or Computer Engineering with 8+ years of professional experiences in design.

• This position requires US Citizenship status.

Desired Characteristics:

• Master’s degree in Electrical Engineering with 15+ years of professional experience in digital design.

• Proven history of architecting complex digital hardware.

• Knowledge of board level digital design process from schematic capture, implementation, integration, and verification.

• Experience designing with Gigahertz microprocessors, FPGA, CPLD, DDR4 memory, flash memory.

• Experience with large pin count devices, 1000+ pins with 0.8mm device pitch or smaller

• Experience in High Density Interconnect (HDI) technologies (micro vias, buried / blind vias, back drilling) for IPC Class 3 board.

• Experience in design of 5+ Gbps serial links. (10GBASE-KR, PCIe Gen3, Fiber Optics)

• Experience designing with CAN, MIL-STD-1553, ARINC 429, ARINC 664, TSN.

• Experience with OpenVPX and PIC-SIG standards.

• Experience in the Mil/Aero/avionics, DO-254 and Civil FFA Certification.

  If interested click apply now, or forward resume to [email protected] or [email protected] or cllick APPLY NOW.

Pay Details: $125,000.00 to $160,000.00 per year

Equal Opportunity Employer/Veterans/Disabled

Military connected talent encouraged to apply

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